Diamond Double Side Polishing machine Feature rotary models with sophisticated control systems. This model is capable of executing complex lapping and polishing routines process while producing precise and repeatable results with a special auto-facing unit to control plate performance.
Diamond Double Side Polishing machine Application:
• Sapphire Substrate / Wafer
• Semiconductor Wafer
• Tungsten Carbide Parts
• Ceramic Parts
• Valves
• Crystal Glass
• Oscillator Parts
technical parameter:
Items | SSP-36DPAW | SSP-50DPAW |
|
Polishing plate | Plate material | Oxygen free Cu , Resin-Cu | Oxygen free Cu |
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Or Tin plate (*option) | or Tin plate(*option) |
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Plate size | Φ910mm | Φ1240mm |
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Revolution control | By inverter. | Home position. |
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Plate cooling | Cooling water jacket | Cooling water jacket |
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Pressure plate | P. Plate | 4 axles. | 4 axles.
(driving force system individually) |
|
|
Block size | 360mmΦ | 485mmΦ |
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Applied pressure | By cylinder | By cylinder |
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Work block | - | Auto Centering |
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Facing unit | Mounting type. | Square type. |
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Capacity / batch | 4 inch wafer x 24 Pcs | 4 inch wafer x 40 Pcs |
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6 inch wafer x 12 Pcs | 6 inch wafer x 24 Pcs |
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Utility | Electricity | AC220V, 3Phase, 60Hz | AC220V, 3Phase, 60Hz |
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Pneumatic | 0.5~0.8 Mpa | 0.5~0.8 Mpa |
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Etc | Machine Size | 1350 *2250 *1920 mm | 1640 *3029 *2575 mm |
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Machine Weight | 3,500Kg. | 5,500Kg. |
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Controller | Touch Screen (Proface) | Touch Screen (Proface) |
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Signal lamp with alarm |
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